The path to smarter ICs with scalable and efficient design
Discover strategies and advanced tools to enhance IC development
The race for semiconductor innovation has never been more intense. Whether you're designing digital, analog, mixed-signal ASICs, SoCs, 3D ICs, or FPGAs, the challenges of performance, power and scalability demand a smarter, more integrated approach.
In this exclusive webinar, industry experts will reveal cutting-edge strategies to streamline IC design, reduce costs and accelerate time to market. Learn how integrated design and advanced packaging solutions are transforming semiconductor development—empowering teams to push boundaries while maintaining efficiency, quality and security.
What you’ll learn:
- Adopt a holistic approach to semiconductor development to meet evolving market demands
- Leverage advanced tools and streamline collaboration to optimize performance
- Gain insights into 3D IC package design that enhances yields and scalability
- Implement design-for-manufacturing principles for superior efficiency
- Safeguard intellectual property with robust cybersecurity and governance frameworks
Watch this webinar to learn innovative strategies for staying ahead in the IC design landscape.
主讲嘉宾
迈克尔·蒙西 (Michael Munsey)
半导体行业副总裁
迈克尔·蒙西在半导体行业拥有 30 多年的经验，并已利用其在全球业务开发、战略、销售和营销方面的广泛背景推动西门子的半导体技术进步。在加入西门子之前，他曾在多家知名公司担任领导职务，其中包括 Perforce，他担任营销和战略高级副总裁并监督 Methodics 的收购和整合；他还曾在达索系统担任高科技行业副总裁并建立了半导体行业，以及在 Cadence Design Systems 监督他们的功能验证计划并推出了 Incisive 验证平台。蒙西在塔夫茨大学获得学位后，在 IBM 开始了他的半导体设计职业生涯。他积极参与多个行业团体，致力于制定标准和塑造半导体行业的发展方向。此外，他还是 Tau Beta Pi 的活跃成员和志愿者。
桑卡吉特·查克拉博蒂 (Sankhajit Chakraborty)
电子和半导体全球总监
桑卡吉特·查克拉博蒂在他 25 多年的领导管理经验中曾在半导体/电子跨国公司工作。他领导实施了多个 M&A、PLM、EDA、供应链和制造系统实施。桑卡吉特目前担任电子和半导体行业解决方案和战略全球总监，为开发新的或增强的产品功能、典范实践、方法、工具和解决方案提供架构监督、广泛的解决方案视图和市场价值定义，以确保客户和行业与 Siemens Xcelerator 产品组合保持一致。