Will your electronics survive an earthquake?

Electronic assemblies are subject to dynamic loads such as jolts, earthquakes, and other jarring motions. The need to effectively verify the integrity of electronic assemblies and components can be solved by stress and dynamic simulation long before production. Often, higher-level validation is required via digital simulation using stress and dynamics analysis.

You will learn how to:

• Extract structural and dynamic loads
• Setup stress and dynamics analyses
• Postprocess results