The path to smarter ICs with scalable and efficient design

The race for semiconductor innovation has never been more intense. Whether you're designing digital, analog, mixed-signal ASICs, SoCs, 3D ICs, or FPGAs, the challenges of performance, power and scalability demand a smarter, more integrated approach.

In this exclusive webinar, industry experts will reveal cutting-edge strategies to streamline IC design, reduce costs and accelerate time to market. Learn how integrated design and advanced packaging solutions are transforming semiconductor development—empowering teams to push boundaries while maintaining efficiency, quality and security.

What you’ll learn:

• Adopt a holistic approach to semiconductor development to meet evolving market demands
• Leverage advanced tools and streamline collaboration to optimize performance
• Gain insights into 3D IC package design that enhances yields and scalability
• Implement design-for-manufacturing principles for superior efficiency
• Safeguard intellectual property with robust cybersecurity and governance frameworks

Watch this webinar to learn innovative strategies for staying ahead in the IC design landscape.