The path to smarter ICs with scalable and efficient design
Discover strategies and advanced tools to enhance IC development
The race for semiconductor innovation has never been more intense. Whether you're designing digital, analog, mixed-signal ASICs, SoCs, 3D ICs, or FPGAs, the challenges of performance, power and scalability demand a smarter, more integrated approach.
In this exclusive webinar, industry experts will reveal cutting-edge strategies to streamline IC design, reduce costs and accelerate time to market. Learn how integrated design and advanced packaging solutions are transforming semiconductor development—empowering teams to push boundaries while maintaining efficiency, quality and security.
What you’ll learn:
- Adopt a holistic approach to semiconductor development to meet evolving market demands
- Leverage advanced tools and streamline collaboration to optimize performance
- Gain insights into 3D IC package design that enhances yields and scalability
- Implement design-for-manufacturing principles for superior efficiency
- Safeguard intellectual property with robust cybersecurity and governance frameworks
Watch this webinar to learn innovative strategies for staying ahead in the IC design landscape.
Conoce a los ponentes
Michael Munsey
Vice President of Semiconductor Industry
With over 30 years of experience in the semiconductor industry, Michael Munsey leverages his extensive background in global business development, strategy, sales, and marketing to drive semiconductor technology advancements at Siemens. Before joining Siemens, he held leadership positions at several prominent companies, including Perforce where he was Senior Vice President of Marketing and Strategy and oversaw the acquisition and integration of Methodics, Dassault Systèmes where he was Vice President of the High Tech Industry and built their Semiconductor Industry, and Cadence Design Systems where he oversaw their functional verification program and introduced the Incisive verification platform. Munsey began his career in semiconductor design at IBM after obtaining degrees from Tufts University. He is actively involved in several industry groups focused on setting standards and shaping the direction of the semiconductor sector. Additionally, he is an active member and volunteer of Tau Beta Pi.
Sankhajit Chakraborty
Solution & Strategy Director
Sankhajit Chakraborty brings over 30 years of technical leadership and management expertise in the semiconductor and electronics industries, having worked with renowned multinational companies such as Toshiba, Intel, ON Semiconductor, Atmel, Microchip, Broadcom, and Siemens. He has successfully led initiatives across system software development, microelectronics, PCB product design, product lifecycle management, supply chain optimization, design for manufacturing, and manufacturing system implementations. Additionally, Chakraborty has played a key role in executing multiple end-to-end mergers and acquisitions for Intel, ON Semiconductor, Atmel Corporation, and Broadcom. At Siemens DISW, he provides architectural oversight, drives the creation of broad solution strategies, and defines market value for new and enhanced product capabilities. He also leads the development of best practices, methodologies, tools, accelerators, and solutions. Notably, he spearheaded the creation of the industry’s first end-to-end commercial Semiconductor Lifecycle Management (SLCM) software solution, enabling digitalization and accelerating customers' digital transformation journeys. Chakraborty holds a Bachelor's degree in Electronics and Telecommunications Engineering, a Master's degree in Computer Engineering and Artificial Intelligence, and is PMP-certified by the Project Management Institute.