Cre8Ventures partnership with Roofline
Unlocking Edge AI Potential in Automotive Manufacturing
Join our webinar to discover how Siemens Cre8Ventures and Roofline’s Edge AI solution is transforming automotive manufacturing with smarter, faster, and more efficient processes. Learn how this partnership not only enhances production but also creates a better environment for startups navigating the European Chips Act. Gain valuable insights from industry experts on the future of AI-driven innovation and semiconductor growth. Don’t miss this opportunity to stay ahead in the evolving tech landscape!
Register now!
Vorstellung der Referenten
Carson Bradbury
Director – EU Chips Act & Co-founder Siemens Cre8Ventures, Siemens EDA
Carson Bradbury serves as Director - EU Chips Act and Co-founder of Siemens Cre8Ventures.
With a focus on harnessing the EU Chips Act to drive innovation across the big data economy, Carson brings a background in innovating and leading international business development vehicles.
His commitment centers on developing a transformative Digital Twin Marketplace that bridges academia, startups, investors, and corporates—enabling faster pathways to value and accelerating impactful collaborations.
Jan Moritz Joseph
CEO and Co-Founder
Jan Moritz Joseph is a co-founder and the CEO or Roofline. Roofline is a German deep-tech startup that makes edge-AI deployment simple with its innovative AI compiler technology. Previously, Dr. Joseph held various roles in research and development of AI and computer architectures. He received multiple awards, e.g., the HiPEAC technology transfer award, the faculty award for his PhD thesis, and he is a member of the Young Academy of the Arts and Sciences in North-Rhine Westphalia.
Verwandte Ressourcen
Vorschlag für eine Standardisierung von Chiplet-Modellen für die heterogene Integration
Die Vorteile, die durch die heterogene Integration von Chiplet-Einheiten in Advanced IC-Packaging entstehen, führen zu einer höheren Nachfrage auf neuen Märkten.
Heterogeneous Packaging Design and Verification Workflows
Learn about the workflows required for 3DIC chiplets based on heterogeneous integration and how STCO enables architectural exploration. Watch now.
Using chiplet design kits to help pave the way for 3D IC heterogeneous integration
Learn about standardized chiplet models or chiplet design kit (CDK) for heterogeneous integration of 3D IC designs. Read more.