An increasing number of applications require complex multi-chiplet or multi-chip modules in small and inexpensive advanced packaging. To maximize production line utilization and profitability, manufacturers must mix multiple products in the same lot and perform different operations on each product at certain steps in the production process. To meet semiconductor quality and audit requirements it is imperative that the devices produced can be tracked on item-level without affecting production rates.
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When there is a requirement to track and trace individual device e.g. as part of advanced packaging, a new way of processing data beyond the scope of an traditionally manufacturing execution system (MES) is necessary.
Three primary challenges to realize single item tracking include:
Most semiconductor manufacturing companies cannot perform single device tracking without slowing down the operation. This is a challenge particularly now, with the acute semiconductor shortage and booming demand worldwide.
A new high-performance approach makes high volume of single item tracking possible. Integrated within the manufacturing execution system (MES), the high-performance engine (HPE) manages this at production rates without affecting capacity.
Semiconductor manufacturing quality can improve with single device tracking – populating device data for every step throughout the manufacturing journey. With data available for every device at every step through the entire supply chain, traceability is a way to improve quality control and reduce containment impact in the case of issues.