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Out-of-the-Box HPC: Physical Design Implementation

Out-of-the-Box HPC: Physical Design Implementation

To meet high-performance computing (HPC) targets, specific challenges must be considered. Because the margins for achieving design closure on HPC designs at signoff are very small, every step of the physical implementation flow needs to address PPA metrics and avoid pessimism. HPC designs also need effective datapath skewing, from place optimization all the way through route optimization, to meet their challenging frequency targets.

In this webinar you will learn:

  • How the detail-route–centric architecture of the Siemens Aprisa digital implementation design solution makes it possible to derive the push-and-pull offsets during place optimization and effectively realize them during route optimization
  • How Aprisa correlates extremely well with the STA and DRC Signoff tools, allowing designers to adopt the flow very quickly for their advanced node designs
  • About an HPC at an advanced process node implemented in Aprisa using its out-of-the-box flow, and how the above technologies helped achieve the desired frequency target.

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數十年來,Siemens 一直在電腦晶片設計和製造領域大規模部署 AI,幫助我們的客戶為全球人類提供更優質的產品。本白皮書將以幾個解決方案範例簡述 Siemens 如何利用人工智慧和機器學習技術來開發 EDA 軟體。