How to design a performance-optimized power module in a week
The power electronics industry is undergoing a significant transformation, driven by emerging trends that enable greater efficiency, reliability, and innovation, from renewable energy to e-mobility.
The need to miniaturize to save weight and improve electrical and thermal performance is driving the adoption of wide bandgap semiconductors and the development of novel packing materials and technologies to meet growing and diversifying market demands.
The market for power modules is growing at around 30%, but creating a high-performance power module is becoming more difficult. It can take many months to develop and requires intensive engineering effort. In short, your process isn't scalable and doesn't optimally use your limited engineering resources.
Join us to see how designing a power module workflow can be compressed from months into just a few days and with a performance profile tailored to your customers' requirements rather than a module that is just good enough.
Key takeaways
- Learn the importance of power drivers and associated market trends and drivers.
- Understand the challenges with power module design and issues with existing workflows.
- Discover a new performance-focused approach to power module design that is resource-efficient, minimizes errors and is highly automated.
- Consider how modules can be tested during production once designed to confirm their reliability and field lifetime, exceeding the requirements of ECPE AQG-324.
Meet the Speakers
Dr. John Parry
Strategic Business Development Manager, Simulation & Testing Solutions
Parry, the industry lead for Simcenter solutions for the electronics and semiconductor industries, was the general chair of the SEMI-THERM 21 conference. He serves on the JEDEC JC15 Thermal Standards Committee, and on various conference committees. Parry has given several invited and keynote talks related to CFD, electronics cooling simulation and thermal characterization. His technical contributions to the discipline of electronics cooling include developing compact thermal modeling methodologies for fans, heat sinks, chip packages and LEDs. Parry also has expertise in design of experiments, optimization, thermal characterization, and active power cycling.
Rod Dudzinski
Market Development Manager
Before joining Siemens, Dudzinski led the effort to bring to market multiple EDA tools for IC physical design, RFIC design and verification, and circuit-level simulation. In 2022, he championed a new Siemens project focused on the rapidly growing power module market, resulting in a new multi-domain optimization solution for embedded and IGBT-style power modules. This new power module optimization solution has proven to reduce the time to design a power module from months to just a few weeks thereby reducing overall development costs and accelerating time to market for power module designers.