点播式网络研讨会
Using Calibre for High Density Advanced Packaging (HDAP) Verification - Part 2
As a Calibre verification engineer, or a semiconductor packaging engineer concerned about package verification, would you be interested in learning why many of the leading fabless semiconductor companies choose to verify their high density advanced packaging (HDAP) assemblies with Calibre? This two-part webinar series is your chance to find out!
相关资源
White Paper
对异构 2D/3D 封装连接关系进行功能验证的创新方式
了解验证封装连接关系所面临的挑战，以及如何使用形式工具来验证封装设计的连接关系。