Electronics has become the main source of added value, revenue and profit in many industries, disrupting traditional mechanical design workflows. The main mechanical and electrical workflows are concerned with design, and design is “just geometry”. How do we know what is being designed will perform acceptably? There is a need for the design effort to be simulation-driven, with performance confirmed at every step along the way. Thermal design is one of the most vexing challenges in the physical design of smart products. Thermal simulation requires far more information than just geometry, and for simulation-driven design performance must be assessed before we commit to design decisions.
In this webinar, we will discuss the macro-trends and how mechanical and electrical design workflows are being combined to address the top cause of PCB re-spins in late design. We will explore options for creating simulation models before MCAD and ECAD data is available, understand options for dealing with MCAD and ECAD data, and analyze specific needs in context of active power management control strategies for smart products.
仿真与测试解决方案战略业务开发经理
帕里是电子和半导体行业 Simcenter 解决方案的行业领导者,担任过 SEMI-THERM 21 会议的主席。他在 JEDEC JC15 热标准委员会和多个会议委员会任职。帕里曾多次受邀发表与 CFD、电子冷却仿真和热表征相关的主题演讲。他对电子冷却学科的技术贡献包括为风扇、散热器、芯片封装和 LED 开发紧凑的热建模方法。帕里在实验设计、优化、热表征和有源功率循环方面也拥有专业经验。