自动执行 PCB 热分析以缩短开发时间
探索缩短 PCB 热分析周转时间的关键驱动因素，从现代多层印刷电路板（PCB）设计的复杂性到缩短上市时间的无情压力。PCB 热仿真的典型 CFD 分析工作流程具有共同的阶段，例如预处理期间的 EDA 数据导入，其中有机会应用自动化来消除手动重复任务。本次网络研讨会重点介绍使用脚本、录制的宏和 Python 编码的自动化典范做法如何节省时间。了解热工程师如何应用自动化来更好地响应电子工程设计团队，这些团队需要在尽可能短的时间内进行多个需要热验证的 PCB 设计修订。
有关自动化 PCB 热分析的主题：
- 常见的前处理、求解和后处理瓶颈
- 识别 PCB 热分析中的自动化机会
- 高效的 PCB 数据导入和处理自动化，例如 ODB++ 文件
- 标准化批量分析、后处理和报告生成
- 直观的自动化设置，包括录制的宏和脚本
- 在电子冷却仿真中利用 Python 脚本的强大功能
- 示例：动态热仿真控制，增强性能
主讲嘉宾简介
John Wilson
Electronics Product Specialist
John Wilson has over 20 years of electronics thermal design experience in simulation and testing. John has a BS and MS in Mechanical Engineering from the University of Colorado at Denver and then joined Flomerics in 1999 which was acquired by Mentor Graphics and is now part of Siemens Digital Industries Software. John has managed more than 100+ electronics thermal design consulting projects ranging from component level, PCB, enclosure to system level across of a wide range of applications including consumer products, communications, industrial and automotive electronics.He has developed a practical, comprehensive knowledge of IC package thermal testing and analysis correlation through his work on thermal transient test technology in different applications. John’s experience also encompasses 11+ years of managing teams of engineers performing consulting thermal design projects and supporting clients using simulation and testing tools.