Heterogeneous integration itself isn't new, but new design and manufacturing technologies, combined with new product demands from system integrators, mean that heterogeneous integration and 3DIC are now becoming a necessity in mainstream design. This shift, however, is not without its challenges, as 3D IC is not a simple extension of existing packaging solutions but creates a whole new set of Multiphysics integration considerations. The interaction of thermal, mechanical, reliability, test, and core semiconductor design increases complexity and requires disparate domains to seamlessly collaborate.

In this presentation, we will explore the challenges introduced by 3D IC, the current state of the industry to address those challenges, the ecosystem needed to support 3D IC, and how users today can successfully adopt 3D IC leveraging new solutions, workflows, and 3D IC Design Kits (3DK) from Siemens EDA that are designed specifically with 3D IC in mind.