Designers face enormous challenges for low-power designs. Whether it is IoT at the edge, AI in the datacenter, robotics or ADAS, the demand for increased functionality in SoCs is rapidly outpacing the power budget. Power must be considered at every stage of chip design including performance, reliability and packaging. Waiting to address power until late in the design cycle – post-netlist or during physical implementation – can be extremely costly. The design may overrun the power budget, overheat, or have long term reliability issues that cannot be addressed at the gate level, layout or package selection. The best point in the design cycle to address power is at the beginning during the architectural and RTL stages. The earlier power analysis and optimization starts, the more likely a chip will meet its power objectives.
In this virtual seminar, you will learn the best practices for applying RTL power optimization. These practices are essential for realizing low-power, energy efficient designs and can help you meet power budgets, mitigate potential reliability issues arising out of power and discover thermal issues early to take corrective action. NXP will present their perspective on applying these techniques. You will learn how Siemens EDA’s PowerPro low-power design platform helps simplify low-power design for RTL designers and allows coarse as well as fine grain power analysis and optimization to achieve truly low-power, energy efficient designs.
Seminar Introduction and Power Optimization Overview
This session will provide an overview of the seminar and key learning objectives. you will learn how best practices for applying RTL power optimization. These practices are essential for realizing low-power, energy efficient designs can help you meet power budgets, mitigate potential reliability issues arising out of power and discover thermal issues early to take corrective action.
Speaker: Qazi Ahmed
NXP: RTL Power Optimization Use Case
Best practices for applying RTL power optimization are essential for realizing low-power, energy efficient designs and can help you meet power budgets, mitigate potential reliability issues arising out of power and discover thermal issues early to take corrective action. NXP will present their perspective on applying these techniques.
Speaker: NXP: Vasundhra Kaushal
Meet the Speakers
Qazi Faheem Ahmed
Principal Product Manager for PowerPro
Qazi is the Principal Product Manager for PowerPro low-power platform at Siemens EDA. He has over 17 years of experience spanning across ASIC/FPGA design and EDA.
Vasundhra Kaushal
Front-end ASIC Designer
Vasundhra has worked in the field of front-end ASIC design for more than 6 years. Prior to working with NXP, Vasundhra worked with Intel for around 5 yrs in frontend RTL design, DFT. She has also owned frontend design power with owning UPF. Most recently, Vasundhra has been working at NXP for the last 1.5 years, owning the complete RTL to GDS power flow.
Vasundhra holds a Master’s degree in VLSI from Vellore Institute of Technology.