As the demand for higher performance, lower power, and more complex systems grows, the semiconductor industry is shifting towards 3D IC and heterogeneous integration (HI) solutions to meet these challenges. These advanced architectures combine multiple dies, chiplets, and specialized accelerators into a single, scalable system. However, the complexity of merging the IC and packaging worlds presents significant design and workflow challenges, especially in the context of large-scale systems like data centers and high-performance computing (HPC).

What you will learn:

• The challenges and opportunities in 3D IC and heterogeneous integration, including system-level analysis and design optimization
• How Innovator3D IC (i3D) bridges the gap between IC and packaging, providing a cohesive design and analysis workflow
• The role of advanced packaging technologies like chiplets, HBM, and UCIe in enabling scalable, low-power, high-performance solutions
• How to leverage i3D's AI-driven tools for early predictive insights, reducing iteration cycles and improving system reliability
• Techniques for empowering analysis teams to merge IC and package data efficiently and gain actionable insights early in the design process.