Multiphysics design optimization of a power module cooling solution

To achieve fastest time-to-market and to meet development goals for the lowest cost of a reliable power electronics module, integrating accurate simulation closely with electronic and mechanical design flows is highly advantageous. This webinar explores use of thermal simulation, electro-thermal modeling through to thermo-mechanical stress analysis, and also aspects of evaluating stray inductance with electromagnetic simulation.

The presentation first discusses a multi-domain power module design & verification flow. This includes highlighting opportunities to bring thermal CFD analysis and structural analysis closer to true ECAD-MCAD co-design through advanced automation. A novel design exploration workflow that enables engineering teams to achieve an optimal power module design faster will be showcased through a detailed example.

Whether you your work relates to power semiconductor integration into end products, a full inverter design for an electric vehicle, or designing thermal management solutions for any form of power module, this webinar will be thought provoking if faster development is your aim.

Key topics include:

• Utilizing simulation in the design of a power module cooled by a cold plate and key factors influencing performance
• How to leverage thermal analysis, and thermo-mechanical stress analysis in a CAD embedded CFD simulation environment
• Connecting EDA driven electronic layout design automatically to 3D thermal CFD simulation and structural analysis workflow
• Optimization by evaluating 100’s or 1000’s of parameter variations more efficiently: how to apply a smart algorithm driven approach to accelerate design space exploration (powered by HEEDS)
• Advanced optimization example: Minimizing unwanted electrical, thermal, hydraulic and mechanical characteristics by evaluating inductance, temperature, pressure drop, warpage using simulation.
• Silicon Carbide (SiC) MOSFET placement exploration for thermal performance accounting for electronic design layout constraints
• Cold plate pin structure optimization (diameter , pitch etc) to achieve low pressure drop and deliver required heat dissipation performance to ensure junction temperatures stay within suitable ranges for reliability.