Electronics has become the main source of added value, revenue and profit in many industries, disrupting traditional mechanical design workflows. The main mechanical and electrical workflows are concerned with design, and design is “just geometry”. How do we know what is being designed will perform acceptably? There is a need for the design effort to be simulation-driven, with performance confirmed at every step along the way. Thermal design is one of the most vexing challenges in the physical design of smart products. Thermal simulation requires far more information than just geometry, and for simulation-driven design performance must be assessed before we commit to design decisions.
In this webinar, we will discuss the macro-trends and how mechanical and electrical design workflows are being combined to address the top cause of PCB re-spins in late design. We will explore options for creating simulation models before MCAD and ECAD data is available, understand options for dealing with MCAD and ECAD data, and analyze specific needs in context of active power management control strategies for smart products.
Strategic Business Development Manager, Simulation & Testing Solutions
전자 및 반도체 부문 Simcenter 솔루션의 업계 리더인 Parry는 SEMI-THERM 21 컨퍼런스의 총괄 의장이었으며 JEDEC JC15 열 표준 위원회와 다양한 컨퍼런스 위원회에서 활동하고 있습니다. Parry는 CFD, 전자 냉각 시뮬레이션, 열 특성화와 관련된 여러 초청 강연 및 기조 연설을 진행했습니다. 팬, 방열판, 칩 패키지, LED용 소형 열 모델링 방법론 등 전자 냉각 분야의 다양한 기술 개발에 기여했습니다. 또한 실험 설계, 최적화, 열 특성화, 유효 전력 순환 관련 전문 지식을 보유하고 있습니다.