Accelerating PCB thermal analysis for rapid drone development

Designing effective thermal management for drone electronics presents unique challenges. Power-dense electronics, where PCBs house in tightly constrained spaces, have crucial components for power management, mission sensor processing, and flight control – that all require adequate cooling. Engineers must balance strict size, weight, power, and cost (SWAP-C) goals with the demands of harsh operating environments. Additionally, competitive consumer and commercial drone markets require rapid development cycles.

Attend this webinar to learn about HeatSync's approach to PCB thermal analysis and cooling solutions for drone and similar electronics products. Azita Soleymani, CTO of Heat-Sync, will share insights on applying CAD-embedded CFD to PCB thermal modeling from early-stage design to final verification. She will also cover best practices for streamlining workflow and data exchange between electronic and mechanical design teams to shorten development. Discover how one drone project achieved a 50% reduction in thermal analysis time and a 12% weight reduction, all while meeting performance goals to ensure reliability.

Topics include:

• Cooling requirements for UAV and drone electronics performance and operational environments
• Defining thermal management design goals
• Early-stage PCB component placement studies and cooling solutions evaluation
• CAD embedded CFD simulation and incorporating ECAD data into thermal analysis studies at different stages of design
• Best practices for electrical and mechanical engineering team collaboration and workflow
• How to go from concept to verification to flying prototypes in less time