Digital implementation and AI Panel at DAC

Wei Lii Tan is Director of Product Management at Siemens DI SW’s Digital Design Creation Platform division, leading product management for the Aprisa RTL-to-GDS solution. Wei Lii has 20 years of experience in semiconductor and EDA, delivering solutions that help designers achieve faster, more efficient design closure through innovative new technologies. He has a master’s degree in electrical engineering from Mississippi State University, and an M.B.A. from Santa Clara University.

Ann Mutschler is senior executive editor for EDA at Semiconductor Engineering. She has been an editor and journalist since 1992, focused on technology, and the semiconductor industry. Her previous experience includes a long stint as a Senior Editor at Reed Business Information for publications including EDN, Electronic News and Electronic Business.

Ankur Gupta is Senior Vice-President and General Manager of Digital Design Creation Platform for Siemens EDA. He and his global team are responsible for developing and marketing best-in-class digital design solutions for the Semiconductor industry. This includes DFT and Lifecycle solutions, High-Level Synthesis, RTL2GDS, and Power Analysis and optimization from RTL to gate-level. Finally, EM/IR Signoff for Analog and Digital.

Ankur brings 20+ years of experience in Digital design, implementation and signoff. He oversaw several deployments of an RTL2GDS solution, while at Cadence. Later, at Ansys, he oversaw the launch and deployment of a market leading digital power-grid signoff product.

Fredrick Roby is a seasoned technology executive with a distinguished career spanning engineering, product development, and cloud architecture. Currently, he leads the Solutions Architecture team for the Hi-Tech, Electronics & Semiconductor industries at Amazon Web Services (AWS), where he collaborates with global enterprises to drive innovation and digital transformation across semiconductors, hi-tech electronics and hi-tech manufacturing. His strategic vision and technical acumen have positioned him as a trusted advisor in the tech industry.

Fredrick is an Enterprise technology executive & leader, CTO/VP of Engineering with 25+ years of experience managing pre-sales and engineering organizations. Previous leadership experience at Warner Bros, Green Dot, MySpace, and multiple e-commerce companies; the former CTO of Dollar Shave Club, and VP of Engineering of a publicly traded startup e-commerce business. With an earned MBA from the Anderson School at UCLA, a BS in computer engineering from Cornell University and a BS in physics from Lincoln University, well versed in social technology products, techniques, development and deployment as well as the holder of multiple patents.

Fredrick's insights and leadership have been recognized in various forums, including his participation in the AWS & Deloitte Semiconductor CIO community, AWS EDA User Group, and a Warner Media leadership panel during the Nextplay Tech Spotlight virtual conference, where he discussed strategies for advancing diversity in tech.

Rajesh Verma is a semiconductor veteran with 30+ years of experience in ASIC digital and analog design. Currently Senior Director of Physical Implementation at MaxLinear, he leads a global digital implementation and physical design team. Previously he was at Qualcomm and AMD/ATI Technologies, where oversaw physical design for cutting edge SoCs. At ATI Technologies, he also helped establish their Hyderabad design center and contributed to the Xbox 360 project. Rajesh’s expertise in advanced technologies and leadership in complex silicon programs makes him a key driver of innovation and efficiency.

Dinesh Jayabharathihas an MS (Electrical Engineering) from Southern Illinois University, M.B.A. from University of Phoenix, and 30+ years of experience in Silicon implementation, from board designto ASIC designto Silicon debug to yield enhancement. He has worked on all aspectsof the design from RTL-to-GDS and beyond for the last 2 decades, and published IEEE papers and have several US Patents”.

Hyojin Choi is a Principal Engineer at Samsung Electronics Memory Division, working on AI- and ML-driven design automation for memory devices such as HBM, DRAM, and NAND Flash. He develops Agentic AI in-house tools, Generative AI EDA solutions, and scalable infrastructures. He holds a B.S. and Ph.D. in Electrical Engineering and Computer Science from Seoul National University, Korea.