Scaling 3D IC design: Trends, challenges and practical workflows
3D IC architectures are enabling the next generation of AI, HPC, and advanced semiconductor systems - but scaling these designs introduces new challenges across heterogeneous integration, die-to-die connectivity, thermal behavior, power delivery, and system-level verification.
In this webinar, an industry analyst from Futurum Group will share insights into the latest 3D IC market trends, adoption drivers, and design challenges. Siemens experts will then provide an overview of the Innovator3D IC solution, followed by a workflow demonstration showing how teams can support early architecture exploration, die-package-system co-design, and integrated 3D IC planning.
Attendees will learn:
- Key industry trends driving 3D IC adoption for AI, HPC, and advanced semiconductor applications
- Common technical and ecosystem challenges facing 3D IC design teams
- How Siemens Innovator3D IC supports system-level planning and co-design
- How an integrated workflow can help teams improve design efficiency, reduce risk, and accelerate development
- What a practical 3D IC workflow looks like through a live product demonstration
Join this session to hear an expert industry perspective from Futurum Group and see how Siemens Innovator3D IC enables scalable, efficient 3D IC design workflows from early planning through implementation.
講演者の紹介
Kevin Rinebold
Technology Manager for 3D IC and Heterogeneous Packaging Solutions
Kevin is the technology manager for 3D IC and heterogeneous packaging solutions at Siemens EDA. He has 34 years of experience in defining, developing, and supporting advanced packaging and system planning solutions for the semiconductor and systems markets. He’s pioneered some of the earliest solutions for co-design working closely with customers to adopt and deploy advanced solutions for technologies like FOWLP and 2.5D/3D packaging.
Kevin is a regular contributor and speaker at industry events and has authored numerous articles on planning, design, and verification methodologies for heterogeneous packaging.
Prior to joining Siemens EDA, Kevin was product manager for IC packaging and co-design products at Cadence. He’s held similar positions at Sigrity, Synopsys, and Xynetix.
Brendan Burke
Research Director, Semiconductors, Supply Chain, and Emerging Tech
Brendan Burke is Research Director, Semiconductors, Supply Chain, and Emerging Tech at Futurum. He advises clients on strategic initiatives and leads the Futurum Semiconductors Practice. He is an experienced tech industry analyst who has guided tech leaders in identifying market opportunities spanning edge processors, generative AI applications, and hyperscale data centers.
Before joining Futurum, Brendan consulted with global AI leaders and served as a Senior Analyst in Emerging Technology Research at PitchBook. At PitchBook, he developed market intelligence tools for AI, highlighted by one of the industry’s most comprehensive AI semiconductor market landscapes encompassing both public and private companies. He has advised Fortune 100 tech giants, growth-stage innovators, global investors, and leading market research firms. Before PitchBook, he led research teams in tech investment banking and market research.
Brendan is based in Seattle, Washington. He has a Bachelor of Arts Degree from Amherst College.
Andras Vass-Varnai
Portfolio Development Executive for Electronics and Semiconductor
Andras Vass-Varnai obtained his MSc and PhD degrees in Electrical Engineering from the Budapest University of Technology and Economics. He spent over a decade at Mentor Graphics as a product manager, leading various R&D projects focused on thermal test hardware and methodologies. Before assuming his current role as a 3D IC reliability solution engineer, Andras served as a business development lead in South Korea and the United States. Now based in Chicago, IL, he is dedicated to contributing to the development of a novel 3D IC package toolchain, leveraging his experience in thermal and reliability engineering.
His main areas of interest include thermal management of electronic systems, advanced applications of thermal transient testing and modeling, semiconductor packaging, characterization of TIM materials, and reliability testing of semiconductor devices.