Elevating Systems Design: Unlocking the Power of Siemens’ Next-Gen Platform
Last year we unveiled our vision for a next-generation PCB Design platform which empowers engineering organizations to overcome the complex challenges they face. This transformative solution is now a reality, delivering on the promises we made.
As engineering teams grapple with increasing design complexity, resource constraints, and the need for seamless collaboration, our AI-infused platform has proven to be a game-changer. With streamlined onboarding, enhanced productivity, and a secure cloud-connected environment, we've addressed the longstanding pain points that have hindered progress in the industry.
In this keynote, we further uncover the key capabilities of this platform, focusing on scalability, enabling both large Enterprises as well as smaller companies to effectively manage digital threads, foster innovation across domains, and deliver positive experiences for engineers and teams.
We'll also offer a glimpse into our roadmap, showcasing the innovations we have planned to take PCB design to new heights. Prepare to be inspired as we as we redefine the future of electronic systems design!
Relatore
A.J. Incorvaia
Senior Vice President, Electronic Board Systems
A.J. Incorvaia joined Siemens Digital Industries Software from Mentor Graphics, where he served since 2014 as vice president and general manager of the Board Systems Division. Prior to this, he was vice president of the PCB and IC Packaging Group at Cadence Design Systems. Other responsibilities during his sixteen years at Cadence included vice president of Product Development and engineering group director. Prior to Cadence, Incorvaia held software development and management positions at Viewlogic and Digital Equipment Corporation. He holds a B.S in Computer Science from Rochester Institute of Technology, and an M.S in Computer Science and Software Engineering from George Mason University.