User2User Europe 2024 General Session
The general session features keynotes from EDA visionaries and thought leaders exploring emerging trends, industry hot topics, and advancements in technology.
Enabling imagination - An integrated approach to system design
Exploding societal demand for semiconductor-enabled products means that semiconductors are now a central part of the worldwide geopolitical discussion. With semiconductors now driving core product differentiation in virtually all areas, broad availability of high-quality leading-edge system design, semiconductor process and an advanced heterogeneous packaging ecosystems is critical to your success. Let’s explore how Siemens are delivering early software validation, manufacturing aware design, AI enhanced design automation tooling, and open ecosystem enablement – to enable your next generation of designs.
Mike Ellow, Executive Vice President, Siemens EDA
Next Generation Electronic Systems Design
As engineering organizations face increasing electronic systems design activity and intense competition, it is crucial to optimize the use of digital threads. These digital threads enable organizations to effectively manage design complexity and foster innovation across multiple domains. However, these organizations encounter resource constraints, talent shortages, data security vulnerabilities, and the need to collaborate effectively with partners and suppliers.
To address these challenges, Siemens has invested in a next-generation solution that redefines the user experience for PCB and systems design. This AI-infused solution offers streamlined onboarding, enhanced productivity, and a cloud-connected environment for seamless and secure collaboration. The goal is to eliminate complexity barriers, accelerate time-to-results, and deliver positive experiences for engineers and teams.
A.J. Incorvaia, Senior Vice President, Electronic Board Systems, Siemens EDA
À propos des intervenants
Mike Ellow
Executive Vice President
Mike Ellow is currently leading both the Integrated Circuits R&D organizations and the sales organization of Siemens EDA (formerly Mentor Graphics). He brings 30 years of technical management experience and executive sales, along with a proven track record of building strong field engineering and sales teams that deliver positive, predictable results. These results are built on a foundation of focusing on customer success. Ellow joined Mentor Graphics in March 2014 as part of the company’s acquisition of Berkeley Design Automation, where he was Vice President of Worldwide Sales. Prior to that, he held various positions at Cadence Design Systems, overseeing sales in North America, Europe, and India, culminating in the role of Corporate Vice President, North American Sales. He began his career as an electrical engineer at Hughes Aircraft and has held management, marketing, and engineering positions in a number of different industries before moving into technical management and executive sales. Ellow has a BSEE from Lehigh University, an MSEE from the University of Southern California, and an MBA from California State University, Fullerton.
A.J. Incorvaia
Senior Vice President, Electronic Board Systems
A.J. Incorvaia joined Siemens Digital Industries Software from Mentor Graphics, where he served since 2014 as vice president and general manager of the Board Systems Division. Prior to this, he was vice president of the PCB and IC Packaging Group at Cadence Design Systems. Other responsibilities during his sixteen years at Cadence included vice president of Product Development and engineering group director. Prior to Cadence, Incorvaia held software development and management positions at Viewlogic and Digital Equipment Corporation. He holds a B.S in Computer Science from Rochester Institute of Technology, and an M.S in Computer Science and Software Engineering from George Mason University.