Integrating electromechanical design with simulation for superior products
Enhancing product performance through design integration and simulation
Overview
Explore the journey from aerospace to smart watches, ensuring excellence in your electronics systems. Join our webinar as we delve into integrated mechanical and electronic design processes, augmented by simulation. Discover the transformative benefits of CAD-embedded Computational Fluid Dynamics (CFD) for enhancing reliability and performance. Gain insights into emerging trends and practical applications shaping the future of electronics systems design.
- Miniaturization and higher component densities:
With the trend toward smaller and more compact electronic devices, there is an increased need to manage heat dissipation in tight spaces. CFD analysis can help optimize thermal management solutions to ensure efficient cooling and prevent overheating in densely packed electronic systems.
We will explore:
- Electric vehicles (EVs) and battery systems:
The growing popularity of EVs and the increasing demand for high-capacity battery systems require effective thermal management. CFD tools can aid in optimizing cooling strategies for batteries, power electronics, and electric motor systems, enhancing their performance, safety, and lifespan.
- Sustainable design:
To meet the growing demand for sustainable and eco-friendly electronics design, CFD can assist in evaluating the environmental impact of electronics systems, optimizing energy efficiency, and reducing material waste, helping designers create more sustainable products.
This webinar is a must-attend event for engineers, designers, and professionals seeking to enhance the performance, reliability, and efficiency of their electronic designs.
Key Takeaways
- Learn the benefits of using MCAD, ECAD and simulation tools which are optimized for each other
- Leverage digital prototyping to reduce both development cost and design re-spins
- Engineer the product right the first time by accurately simulating the multiphysics phenomena of real world devices before building them
À propos des intervenants
Greg Arnot
Product Marketing Manager
Arnot's electronics career commenced in the 1990s at Hewlett-Packard in Barcelona, Spain. He served in product management and global business development positions within the Inkjet Commercial Division until 2004, when he founded a wireless startup focusing on social proximity applications for Facebook. Later, he led the U.S. operations of GreenPowerMonitor, a top solar monitoring firm. In February 2020, Arnot joined UltraSoC's product management team, which Siemens DISW acquired in October 2020. Subsequently, he transitioned to the Siemens NX team in June 2022.
Dr. John Parry
Strategic Business Development Manager, Simulation & Testing Solutions
Parry, the industry lead for Simcenter solutions for the electronics and semiconductor industries, was the general chair of the SEMI-THERM 21 conference. He serves on the JEDEC JC15 Thermal Standards Committee, and on various conference committees. Parry has given several invited and keynote talks related to CFD, electronics cooling simulation and thermal characterization. His technical contributions to the discipline of electronics cooling include developing compact thermal modeling methodologies for fans, heat sinks, chip packages and LEDs. Parry also has expertise in design of experiments, optimization, thermal characterization, and active power cycling.