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Flexible circuits, rigid demands

Optimizing pcb design workflows

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flexible circuit board design

Flexible printed circuits (FPCs) are taking off. The use of FPCs is surging in consumer electronics and other high-tech products where small, compact packaging is required. But FPC design can be a challenging task with generic modeling tools. In this webinar we'll introduce a complete suite of tools to effectively design not only flexible circuits but also rigid-flex designs. We'll also describe how to keep electronic and mechanical domains perfectly in sync across every step of the design process. Tune in as we explore the only mechanical CAD solution that can accurately represent rigid-flex designs.

This webinar will demonstrate the latest tools available to the mechanical designer for creating complex PCB designs with familiar easy to use commands. All too often, traditional modeling methods are used to create PCB designs and are mostly unsuited for the job. Once the formed shape is created, the challenge comes when trying to create the flattened form of the design for transfer to the ECAD domain for component layout.

With the right tools, this is no longer a challenge. We'll explore a dedicated flexible printed circuit design application for creation, flattening and downstream documentation preparation. We'll show how creating accurate rigid-flex designs that faithfully represent the final product is now achievable in the MCAD domain. As a user you can create a layer scheme that represents the PCB stackup, select the appropriate stack for each area of the board and represent the most complex of designs with ease.

Learn the different techniques for creating rigid-flex, how to create the flattened form and how to document the design. Join us for a nonstop tour of the most efficient workflow available today.

Key Takeaways

  • Gain an understanding of the rigid-flex construction
  • Learn about the design workflow with the MCAD environment
  • Consider the four different creation techniques
  • Understand the different workflows

À propos des intervenants

Siemens Digital Industries Software

Greg Arnot

Product Marketing Manager

Arnot's electronics career commenced in the 1990s at Hewlett-Packard in Barcelona, Spain. He served in product management and global business development positions within the Inkjet Commercial Division until 2004, when he founded a wireless startup focusing on social proximity applications for Facebook. Later, he led the U.S. operations of GreenPowerMonitor, a top solar monitoring firm. In February 2020, Arnot joined UltraSoC's product management team, which Siemens DISW acquired in October 2020. Subsequently, he transitioned to the Siemens NX team in June 2022.

Siemens Digital Industries Software

Dave Walker

Senior Technical Product Manager

Dave joined Siemens in 2011 with more than 30 years of mechanical engineering experience in multiple industries, including consumer electronics, renewable energy and network infrastructure. He’s worked for large corporations, SMEs, startups, and as a consultant for high and low volume products with experience in multiple different CAD systems.
As a Senior Technical Software Product Manager, he defines the direction of Siemens NX software for numerous applications, including NX Sheet Metal and NX 2D Nesting.

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