On-Demand Webinar

Verify the integrity of electronic assemblies and components

Estimated Watching Time: 35 minutes

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Would your electronics survive an earthquake? Whether it’s an earthquake or any other real-world conditions, electronic assemblies in modern products are subject to dynamic loads, such as jolts, earthquakes, and other jarring motions that can impact performance.

Dynamic analysis with FEA software

By leveraging digital stress and dynamic simulation, simulation analysis and engineers can effectively verify the integrity of electronic assemblies and components long before production, reducing the need for costly prototypes (and in some cases eliminating the need for prototypes altogether). In this webinar, you will learn how to perform higher-level validation of products using digital simulation using stress and dynamics analysis.

Key Learnings

In this webinar, you will learn how our industry-leading finite element analysis (FEA) software enables simulation analysts and engineers to:

  • Extract structural and dynamic loads

  • Setup stress and dynamics analyses

  • Postprocess results