Are We Ready? Succeeding in an AI-Driven, Software-Defined World
In 2011, Marc Anderssen remarked that “software is eating the world”. While software has been eating the world, AI is now rewriting the entire menu—transforming not just what we consume, but how it's created, served, and experienced.
This transformation is creating unprecedented demand for computational resources, with AI workloads driving exponential growth in compute infrastructure requirements. In response, a new wave of software innovation is emerging to orchestrate, optimize, and manage these increasingly complex computational ecosystems—fueling unprecedented demand for semiconductors in our software-defined, silicon-enabled global economy.
Organizations worldwide are making substantial investments in software development capabilities to navigate this transformation. However, electronic development teams face formidable challenges: scaling limitations at the physical level, multi-domain design complexities, fragmented data links across system integration layers, and a thinning engineering workforce amidst growing talent scarcity.
Successfully addressing these obstacles requires leverage of a comprehensive digital twin that goes beyond simulation and embraces a multi-faceted approach: implementing production-grade AI tools, establishing robust requirements capture methodologies, and enabling seamless software/hardware co-design processes. As traditional chip scaling approaches physical constraints, advanced packaging technologies like chiplets and 3D IC design workflows become essential. Cross-domain data management within the silicon lifecycle must connect with broader platforms while preserving domain-specific insights. Strategic partnerships with foundries and service providers round out this comprehensive strategy for enabling responsive, software-driven design processes.
Conoce al invitado
Mike Ellow
Chief Executive Officer
Mike Ellow is CEO, Siemens EDA, Siemens Digital Industries Software, a business unit of Siemens Digital Industries. He leads Siemens EDA (formerly Mentor Graphics) Research and Development as well as EDA Global Sales. Ellow has led Siemens EDA Sales since August 2014 and Siemens EDA ICS R&D since 2023. He brings 30 years of executive sales and technical management experience, along with a proven track record of building strong sales and engineering teams while delivering positive, predictable results. These results are built on a foundation of focusing on customer success.
Ellow joined Mentor Graphics in March 2014 as part of the company’s acquisition of Berkeley Design Automation, where he was Vice President of Worldwide Sales. Prior to that, he held various positions at Cadence Design Systems, overseeing sales in North America, Europe, and India, culminating in the role of Corporate Vice President, North American Sales. Prior to Cadence, he held management, marketing, and engineering positions in a number of different industries. He started his career as an electrical engineer at Hughes Aircraft.
Ellow has a BSEE from Lehigh University, an MSEE from the University of Southern California, and an MBA from California State University, Fullerton.