Siemens workflow for Intel Foundry EMIB platform

Whether you attended DAC 2023 or not you’ll want to be sure to watch and bookmark this recorded technical session.

In this presentation, Mike Walsh, Director of IC Packaging at Siemens EDA discusses and demonstrates how the Intel Foundry platform can be successfully designed and verified within the Siemens workflow.

Intel Foundry will introduce its commercially available embedded silicon bridge-based semiconductor packaging platform. Designing for this platform required a certified workflow and associate design and verification tools. This session introduces the Siemens workflow and demonstrates how the Intel Foundry platform can be successfully designed and verified.

In this session you’ll learn how to:

• Reduce iterations, development cost and risk
• Accelerate design and verification
• Improve reliability through increased simulation coverage
• Optimize design across multiple domains
• Automate multi-discipline verification
• Simplify partnership with a single vendor