Would your electronics survive an earthquake? Whether it’s an earthquake or other real-world conditions, the electronic assemblies embedded in modern products are subject to dynamic loads, such as jolts, earthquakes, and other jarring motions that can impact performance.
By leveraging digital stress analysis and dynamic simulation, simulation analysts and engineers can verify the integrity of electronic assemblies and components long before production, reducing the need for costly prototypes (and in some cases eliminating the need for prototypes altogether). Leading-edge finite element analysis (FEA) software solutions provide engineering organizations with a unique competitive advantage by enabling high-level validation of products using powerful simulation capabilities, such as stress and dynamics analysis.
In this webinar, you will learn how leading-edge FEA software solutions enable simulation analysts and design engineers to:
Applications Engineering Manager
Principal Applications Engineer