on-demand webinar

User2User North America 2024 General Session

Estimated Watching Time: 71 minutes


Photo of User2User North America 2024 Keynote speakers

The general session features keynotes from EDA visionaries and thought leaders exploring emerging trends, industry hot topics, and advancements in technology.

Enabling imagination - An integrated approach to system design
Exploding societal demand for semiconductor-enabled products means that semiconductors are now a central part of the worldwide geopolitical discussion. With semiconductors now driving core product differentiation in virtually all areas, broad availability of high-quality leading-edge system design, semiconductor process and an advanced heterogeneous packaging ecosystems is critical to your success. Let’s explore how Siemens are delivering early software validation, manufacturing aware design, AI enhanced design automation tooling, and open ecosystem enablement – to enable your next generation of designs.
Mike Ellow, Executive Vice President, Siemens EDA

Beyond limits: Paving the Way for a New Era in Semiconductors
AI and software-defined systems have become essential to various industries, transforming the way we operate. TSMC is leading the way in developing leading technology and advance packaging technology. Along with our OIP partners, we have built a comprehensive ecosystem and innovated solution to enable our customer’s innovations. These changes have given rise to a new era in semiconductors, with an exciting future. In this keynote, Dan will delve into the opportunities and possibilities that TSMC has experienced, the challenges that it is currently facing and resolving, and how your involvement can bring power to the semiconductor industry to create a new era together.
Dan Kochpatcharin, Head of Design Infrastructure Management Division, TSMC

Delivering Silicon at Cloud Scale
Amazon is driving innovation in everything from satellites and logistics to cloud services and semiconductors. At AWS, Annapurna Labs is both building silicon for AWS and consuming AWS resources to design newer silicon. Across compute, machine learning, and IO, the demand for new chips is constant and the complexity of each chip is exponentially increasing. Annapurna Labs’ journey embracing the cloud has brought benefits in scaling to the challenges of ever-increasing product complexity. By utilizing the elasticity and scale of the cloud, we’ve been able to reduce time to market while also increasing the sustainability of the design process.
Ali Saidi, Sr. Director Principal Engineer, Amazon Web Services

Meet the speakers

Siemens EDA

Mike Ellow

Executive Vice President

Mike Ellow is currently leading both the Integrated Circuits R&D organizations and the sales organization of Siemens EDA (formerly Mentor Graphics). He brings 30 years of technical management experience and executive sales, along with a proven track record of building strong field engineering and sales teams that deliver positive, predictable results. These results are built on a foundation of focusing on customer success. Ellow joined Mentor Graphics in March 2014 as part of the company’s acquisition of Berkeley Design Automation, where he was Vice President of Worldwide Sales. Prior to that, he held various positions at Cadence Design Systems, overseeing sales in North America, Europe, and India, culminating in the role of Corporate Vice President, North American Sales. He began his career as an electrical engineer at Hughes Aircraft and has held management, marketing, and engineering positions in a number of different industries before moving into technical management and executive sales. Ellow has a BSEE from Lehigh University, an MSEE from the University of Southern California, and an MBA from California State University, Fullerton.


Dan Kochpatcharin

Head of Design Infrastructure Management Division

Dan joined TSMC in 2007. He currently leads TSMC Ecosystem Partners program including EDA Alliance, IP Alliance, DCA Alliance, Cloud Alliance, and 3DFabric Alliance as part of company’s Open Innovation Platform® (OIP). OIP initiative is a comprehensive design technology infrastructure program enabling collaborations, innovations to reduce design barriers and improve first time silicon success. Prior to his current role heading up the design infrastructure management division, Dan led the Japan customer strategy team, the technical marketing and support team for the EMEA region in Amsterdam and was a part of the team leading the formation of Open Innovation Platform® (OIP), IP Alliance program. Prior to TSMC, Dan worked at Chartered Semiconductor both in the US and Singapore where he held a number of management positions, including Director of Platform Alliance, Director of eBusiness, Director of Design Services, and Director of Americas Marketing. He also worked at Aspec Technology and LSI Logic. Dan holds a Bachelor of Science degree in Electrical Engineering from UC Santa Barbara, a Master of Science in Computer Engineering, and an MBA from Santa Clara University.

Amazon Web Services

Ali Saidi

Sr. Director Principal Engineer

Ali received a PhD in Computer Science and Engineering from the University of Michigan in 2008. Since then he was responsible for building simulators at Arm Ltd, defining Arm-based servers, working across ISVs, OEMs, and silicon providers to promote Arm-based servers in data centers. Seven year ago he moved to AWS leading the development of the Graviton-based EC2 instances, which utilizes Annapurna Labs' Graviton CPUs to provide the best price-performance in EC2. In this role Ali oversees the optimizations of HPC workloads on Graviton, working with leading ISVs, including EDA software vendors. He has been a popular keynote speaker at AWS re:Invent.

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