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Single item tracking for efficient semiconductor manufacturing that supports advanced packaging

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Single item tracking for efficient semiconductor manufacturing that supports advanced packaging

An increasing number of applications require complex multi-chiplet or multi-chip modules in small and inexpensive advanced packaging. To maximize production line utilization and profitability, manufacturers must mix multiple products in the same lot and perform different operations on each product at certain steps in the production process. To meet semiconductor quality and audit requirements it is imperative that the devices produced can be tracked on item-level without affecting production rates.

Multi-chip item tracking challenges

When there is a requirement to track and trace individual device e.g. as part of advanced packaging, a new way of processing data is necessary that is typically beyond the scope of an traditionally MES.

Most semiconductor manufacturing companies cannot perform single device tracking without slowing down the operation. This is a challenge particularly now, with the acute semiconductor shortage and booming demand worldwide.

New tracking and tracing methods for advanced packaging ensure efficiency and semiconductor quality

A new high-performance approach makes high volume of single item tracking possible. Integrated within the manufacturing execution system (MES) the high performance engine manages this at production rates without affecting capacity.

Join our new Single Device Tracking webinar to learn more about advanced traceability solutions for semiconductor manufacturing.

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