Electronics has become the main source of added value, revenue and profit in many industries, disrupting traditional mechanical design workflows. The main mechanical and electrical workflows are concerned with design, and design is “just geometry”. How do we know what is being designed will perform acceptably? There is a need for the design effort to be simulation-driven, with performance confirmed at every step along the way. Thermal design is one of the most vexing challenges in the physical design of smart products. Thermal simulation requires far more information than just geometry, and for simulation-driven design performance must be assessed before we commit to design decisions.
In this webinar we will discuss the macro-trends and how mechanical and electrical design workflows are being combined to address the top cause of PCB re-spins in late design. We will explore options for creating simulation models before MCAD and ECAD data is available, understand options for dealing with MCAD and ECAD data, and analyze specific needs in context of active power management control strategies for smart products.
Strategic Business Development Manager, Simulation & Testing Solutions