Demand for increased functionality, constant connectivity, and lower cost is dramatically increasing the complexity of electronic systems. From managing the interconnectedness of complex systems to improving communication across stakeholders to increasing productivity and quality without increasing cost, electronics companies cite increasing system complexity as their most significant product development challenge.
The smaller-denser-faster mantra associated with today’s products magnifies the significance of ensuring that electro-mechanical compatibility is addressed before first fabrication. Waiting until fabrication is not an option to launch products quickly.
Watch this on-demand webinar to learn about ECAD-MCAD co-design.
Designing complex electronic products requires digital transformation to break down the barriers for design teams to start and stay integrated throughout the design process.
Traditional solutions that can't streamline across teams or share data efficiently will lead to critical errors. Attempting to co-design a complex, single electronics system without the appropriate foundational tools and methodologies to ensure successful development will lead to problems.
Addressing today's challenges requires tool and process efficiency that combine to ensure multi-domain collaboration from concept to manufacturing.
A digitally integrated solution across multiple domains:
Multi-discipline product design can significantly benefit the product development process. By working past the impediments to collaboration
and successfully implementing a digitally integrated and optimized product development process, teams can realize:
Thanks to seamless ECAD-MCAD collaboration, mechanical Design for Manufacturing (DFM) checks can be used to review a product for potential mechanical interference and clearance violations based on company and manufacturer guidelines.
Learn how mechanical DFM checks can: