on-demand webinar

PCB electrothermal modeling accuracy and thermo-mechanical analysis workflow


PCB electrothermal modeling accuracy and thermo-mechanical analysis workflow

Co-simulation method combining 3D electronics cooling analysis and DC drop analysis

Learn about a new co-simulation method combining 3D electronics cooling analysis with a board-level power integrity EDA simulation software used for DC drop analysis. Connect typically separate thermal and DC voltage drop analysis tasks to enable closer ECAD-MCAD electrothermal co-design and better temperature prediction and identify areas of high current density.

Reviewing detailed explicit PCB thermal modeling vs PCB as a network assembly

Designers decide how to perform thermal modeling of PCBs, whether it is detailed explicit PCB thermal modeling or modeling a PCB as a network assembly. As a network assembly, designers evaluate the precise thermal conductivity and capacity map of layers and internal structure. Deciding when to use the different types of modeling and why can be helpful to gauge the modeling efforts throughout the workflow.

Leverage thermal analysis results in CAD environments to perform thermo-mechanical stress analysis tasks

Using data from a co-simulation, designers can leverage thermal analysis results to perform a thermo-mechanical stress analysis task directly within a CAD environment. By integrating this task into existing workflows and tools, teams can realize verified PCB thermal designs faster.


Meet the speaker

Siemens Digital Industries Software

John Wilson

Electronics Product Specialist

John Wilson has over 20 years of electronics thermal design experience in simulation and testing. John has a BS and MS in Mechanical Engineering from the University of Colorado at Denver and then joined Flomerics in 1999 which was acquired by Mentor Graphics and is now part of Siemens Digital Industries Software. John has managed more than 100+ electronics thermal design consulting projects ranging from component level, PCB, enclosure to system level across of a wide range of applications including consumer products, communications, industrial and automotive electronics.He has developed a practical, comprehensive knowledge of IC package thermal testing and analysis correlation through his work on thermal transient test technology in different applications. John’s experience also encompasses 11+ years of managing teams of engineers performing consulting thermal design projects and supporting clients using simulation and testing tools.