For many years, the PCB industry has accepted dielectric values without fully understanding how they were measured—or whether they're the right values for impedance modeling. This webinar explores what that means for today's high-speed designs.
As signaling speeds continue to increase, even small errors in dielectric modeling can translate into measurable impedance errors, degraded simulation correlation, and reduced design margins. Most PCB design teams rely on laminate data supplied by material vendors and fabricators—but few engineers understand how those dielectric values were measured, what they actually represent, or whether they're appropriate for impedance modeling. In this webinar, Bill Hargin, founder of Z-zero and developer of Z-planner Enterprise, explains why dielectric measurement orientation matters, how laminate anisotropy affects transmission-line modeling, and what design teams can do to improve impedance prediction accuracy. Drawing on extensive research across hundreds of laminate materials and nearly thirty dielectric characterization methods, Bill explains why many published Dk values are not directly applicable to signal-integrity analysis—and why understanding the difference between Dk(x-y) and Dk(z) is becoming increasingly important for today's high-speed designs.
If you've ever wondered why simulated impedance doesn't always match fabricated hardware—or whether the dielectric numbers in your stackups tell the whole story—this webinar will provide practical answers backed by research, engineering data, and real-world examples. Whether you're designing 56G, 112G, 224G, or simply trying to build more predictable hardware, you'll leave with a better understanding of the physics behind modern PCB impedance planning. Reserve your seat today.

CEO
Bill Hargin is the chief everything officer at Z-zero, developer of the PCB stackup design and material selection software, Z-planner Enterprise. Bill is an industry pioneer, with more than 25 years working in PCB signal integrity and manufacturing, while authoring dozens of articles on signal integrity, stackup design, and material selection. Hargin is also the author of the iConnect007 publication Stackups, the Design within the Design, a regular columnist for Printed Circuit Design and Fabrication magazine, and a contributing author for the Printed Circuits Handbook.
Bill is a regular speaker and panelist at both DesignCon and PCB West, and more than 10,000 engineers and PCB designers worldwide have taken his workshop on high-speed PCB design. Mr. Hargin served as director of marketing for Mentor Graphics’ HyperLynx SI software and as the Director of North American Marketing for Nan Ya Plastic’s PCB laminate division in Taiwan before founding Z-zero.