In this workflow HEEDS is used to drive CFD, Structural and Acoustic simulation software FLOEFD and Simcenter 3D to automatically find the thermal optimum design by varying heat sink dimensions of a GPU while satisfying the criteria set by the structural and acoustics software. HEEDS enables automated workflows for the ease of driving product development processes. With an extensive list of developed interfaces to commercial CAD and CAE tools, HEEDS quickly and easily integrates many technologies without the need for custom scripting. The data is automatically shared between different modeling and simulation products to evaluate performance trade-offs and design robustness.
Simcenter 3D is a comprehensive, fully-integrated CAE solution for complex, multidisciplinary product performance engineering. The software delivers revolutionary improvements in simulation efficiency. With advanced 3D modeling capabilities and simulation solvers that cover a comprehensive range of physics, Simcenter 3D helps you gain better insight into your product’s overall performance. The speaker will demonstrate the complete workflow from geometry preparation of a Graphics Card model to simultaneously solving CFD, Structural, and Acoustics driven by the software HEEDS to find the most optimum design.
Tim Brodovsky is an Application Specialist for thermal analysis software at Siemens DI SW in Portland, Oregon. Tim has 10 years of experience in thermal and airflow in electronics cooling and has expertise in Simcenter Flotherm. He has also worked with Simcenter MicReD thermal transient testing hardware along with Simcenter FLOEFD. Tim holds an MS Mechanical Engineering degree from Portland State University.