Advanced Technologies in PCB Design

As specs call for thinner boards, higher speeds, and greater densities, successfully fabricating and assembling PCBs to include modern advanced technologies can be a difficult and time-consuming process. Typical design processes often result in much higher manufacturing costs. Additional fabrication steps necessary for complex build-up layers, or backdrilling add to the over-all fabrication costs, while smaller traces and tighter spacing result in significant material waste from the greatly reduced yield as the complex boards are manufactured.

Building a modern PCB typically involves a focus on miniaturization, signal integrity, design flexibility and overall cost reduction. This webinar focuses on how advanced technologies are seen by a manufacturer and is intended to help the PCB designer leverage Siemens Manufacturing Driven Design to ensure greater reliability and overall manufacturability.

This webinar covers

• HDI
• Microvia
• Rigid Flex
• Buildup Layers
• Backdrill
• Component Miniaturization