The "bridge" to scale for AI and HPC applications
Designing high-performance multi-chiplet semiconductor packages for hyperscale, HPC and AI applications combines cutting-edge innovation with practical optimization. Embedded silicon bridge substrates enable cost-effective solutions by using base substrates such as organic laminates or redistribution-layer (RDL) buildup, helping overcome the reticle-size and cost limitations of monolithic silicon substrates.
Embedded silicon bridges provide power-efficient, high-speed connections between chiplets and memory, delivering the massive bandwidth required for AI parallelism and hyperscale/HPC energy-efficiency demands. Key challenges remain, including inter-chiplet connectivity, thermal dissipation and power integrity.
In this webinar, Siemens EDA and Intel Foundry will introduce embedded bridge technology and its market applications. Intel Foundry will present its EMIB and EMIB-T technology offerings, followed by a demonstration of the Siemens reference flow for Intel Foundry EMIB and EMIB-T technologies.
What you will learn:
- What is driving the demand for more than Moore in IC design
- How substrate-embedded silicon bridges enable efficient, cost-effective heterogeneous integration and silicon scaling
- An introduction to Intel Foundry's proven Embedded Multi-die Interconnect Bridge (EMIB) technologies
- How a single-vendor, integrated and certified workflow supports Intel Foundry EMIB and EMIB-T technologies
Who should attend:
- IC and IC package verification managers and directors
- IC and IC package design managers and 3D IC program leads
- CAD and methodology managers
- IC, chiplet, semiconductor package and substrate designers
- System and micro architects
- Verification engineers working in physical verification, SI/PI, reliability, thermal and stress analysis
Products covered:
- Innovator3D IC Integrator
- Questa FormalPro
- Calibre 3DThermal
- Calibre 3DStack
- Innovator3D IC Layout
- HyperLynx SI/PI
Lernen Sie die Referierenden kennen
Keith Felton
Principal Technical Product Manager, Advanced Semiconductor Packaging
Keith Felton is Principal Technical Product Manager, Advanced Semiconductor Packaging at Siemens DISW. He has worked extensively in the area of IC Package design since the late 1980’s. In the early 2000’s he drove the launch of the industries first dedicated System-In-Package design solution. Current activities and focus includes driving the strategy and direction for Siemen’s multi-substrate prototyping, design and verification solution for High Density Advanced Packages. In 2017 he led a team that launched the Siemen’s OSAT Alliance program.
Keith holds a co-inventor patent #8,316,342 – Method and apparatus for concurrent design of modules across different design entry tools targeted to a single layout.
Mike Walsh
Director of Technical Applications Engineering for 3D IC
Mike Walsh is Director of Technical Applications Engineering for 3D IC at Siemens DISW. He leads packaging applications engineering and has extensive experience in advanced semiconductor packaging, 2.5D and 3D IC design, multi-die connectivity, and integrated design and verification workflows.
Satish Surana
Senior Principal Engineer
Satish Surana is Senior Principal Engineer at Intel Corporation with more than 20 years of experience in 3D IC advanced-packaging design and technology solutions. His work spans multi-die and package design, design flows, technical leadership, and ecosystem enablement for Intel Foundry advanced-packaging technologies, including EMIB and EMIB-T.