PCB operating temperatures and loss
Controlling stackup design with Z-planner Enterprise
The overwhelming majority of PCB signal-integrity simulations are performed at lab-temperature conditions, while systems in actual operation typically run at significantly higher temperatures. As a result, SI simulations almost always underestimate the actual losses signals will see in real-world operation, which compromises design margins and in some cases can lead to prototype or field failures.
This webinar examines how laminate material properties typically behave as operating temperature increases, and how those changes affect insertion loss. We will discuss the role of laminate resin systems and loss categories and highlight why changes in Df should be accounted for during stackup planning and signal-integrity analysis.
You will learn:
- About key laminate properties that impact PCB performance at elevated temperatures
- How Df and bulk conductivity vary with temperature and how this behavior influences loss budgets
- Df variation as a function of loss category and temperature
- How Dk varies with temperature
- Relative comparisons between dielectric loss, resistive loss, and losses tied to copper roughness
- How to make operating-temperature-aware adjustments in Z-planner Enterprise to build more realistic, conservative loss simulations as part of your design flow
Who should attend:
- Hardware engineers
- PCB designers
- Signal-integrity engineers
Lernen Sie den/die Referierende(n) kennen
Bill Hargin
CEO
Bill Hargin is the chief everything officer at Z-zero, developer of the PCB stackup design and material selection software, Z-planner Enterprise. Bill is an industry pioneer, with more than 25 years working in PCB signal integrity and manufacturing, while authoring dozens of articles on signal integrity, stackup design, and material selection. Hargin is also the author of the iConnect007 publication Stackups, the Design within the Design, a regular columnist for Printed Circuit Design and Fabrication magazine, and a contributing author for the Printed Circuits Handbook.
Bill is a regular speaker and panelist at both DesignCon and PCB West, and more than 10,000 engineers and PCB designers worldwide have taken his workshop on high-speed PCB design. Mr. Hargin served as director of marketing for Mentor Graphics’ HyperLynx SI software and as the Director of North American Marketing for Nan Ya Plastic’s PCB laminate division in Taiwan before founding Z-zero.