Verify the integrity of electronic assemblies and components

Would your electronics survive an earthquake? Whether it’s an earthquake or other real-world conditions, the electronic assemblies embedded in modern products are subject to dynamic loads, such as jolts, earthquakes, and other jarring motions that can impact performance.

Dynamic analysis with FEA software

By leveraging digital stress analysis and dynamic simulation, simulation analysts and engineers can verify the integrity of electronic assemblies and components long before production, reducing the need for costly prototypes (and in some cases eliminating the need for prototypes altogether). Leading-edge finite element analysis (FEA) software solutions provide engineering organizations with a unique competitive advantage by enabling high-level validation of products using powerful simulation capabilities, such as stress and dynamics analysis.

What you'll learn

In this webinar, you will learn how leading-edge FEA software solutions enable simulation analysts and design engineers to:

• Extract structural and dynamic loads
• Setup stress and dynamics analyses
• Post-process simulation results