Avoiding Mechanical Stress with DFM

October 26, 2021

With the increase of assembly density and the decrease in product thickness, mechanical stress has become a growing concern to PCB designers. Learn from one of our exports how to resolve many of these mechanical stress issues in the design phase by applying advanced DFM checking to ensure that you are protecting your sensitive components and producing the most comprehensive PCB design possible.

In this webinar you will learn:

Where in the assembly process mechanical stress can occur

Solutions to flag mechanical stress within the design phase

How to avoid mechanical stress during de-panelization and assembly

How to reduce stress on sensitive components like BGA’s

Design mishaps to look out for when designing rigid flex

Use the VPL to quickly strengthen board design

To use Valor NPI to illuminate DFM issues caused by mechanical stress and improve your overall yield